For most of July I focused on coverage of SEMICON West in 3D. Today, I thought I’d take a look...
After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development...
Semiconductor test and advanced packaging service provider, STATS ChipPAC Ltd. announced its next-generation three dimensional (3D) embedded Wafer Level Ball...
SUSS MicroTec,supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume...
Wow, times have changed. Who would have thought the foundries would ever willingly turn to the packaging industry for the solutions to...
ECTC sure knew how to pack ‘em in early this year! It was no accident that they held a special...
Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. unveiled its bond via array...
We’ve all heard it: Wide I/O DRAM on Logic using TSV interconnects will be THE solution for achieving the high...
I’m thinking about becoming a curator. Not as in the career-changing, get-a-job-at-an-art-gallery sense, but in the curation-vs-aggregation sense. I was...
In the May 15 issue of Future Fab News!, Aaron Hand, contributing editor, asked for opinions on Mark Bohr’s (Intel)...
Want to know how to torture a journalist? Invite them to present at a conference but ask them to sign...
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw...
Some people get excited when they go to Hollywood and see famous people. Not me. Today, I got positively giddy...
It wasn’t on the final agenda, but thanks to a last-minute presentation switch by BiTS Workshop keynoter Jim Feldhan, president...
I don’t get to attend all the 3D events that I would like to, and such was the case with...
MonolithIC 3D Inc., a Silicon Valley startup, announced today that the USPTO has issued MonolithIC 3D three additional patents on monolithic...
A few weeks ago, I came across an article on a new nanotechnology process in development at Rice University that...
The 3D-IC LinkedIn Group announced today that it has reached more than 1,100 members. The discussion forum for 3D Integrated...
Georgia Tech’s Packaging Research Center, in its pioneering chip-last embedded interconnection technology, demonstrates World's Thinnest 3D Organic Package at 130um thickness...
In addition to my Monday blog post, there has been a plethora of articles authored by other industry bloggers about...
