I keep reading about the various ways chip designers can achieve the performance/power benefits required for next generation mobile devices,...
SEMICON West, San Francisco, Calif., July 10, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography...
NEWBURY PARK, CALIF.--Tamar Technology received an order for its WaferScan metrology system from a major semiconductor manufacturer. The system will...
Are there still people who are clueless about 3D? Apparently there are. Lots of them. Despite all the discussion and attention 3D...
“It’s just like peeling a banana” reads the caption on one teardown photo describing the careful dissection of the iPhone...
Somehow the social media “shares” on Friday are more lighthearted than the rest of the week. Today, all the excitement...
I always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to...
SPTS Technologies has launched its low temperature plasma-enhanced chemical vapor deposition (PECVD) solution for via-reveal passivation in 3D-IC packaging applications....
With two 3D focused keynotes and a 3D panel discussion, 3D Thursday was ripe for the tweeting. The sound bites...
I spent this whole week at IMAPS 2012 in San Diego, and tweeted live from the event. Sometimes in the...
The irony of the week: Qualcomm, leader of the wireless world, sends a large contingency to participate in and sponsor...
SEMICON Europa got underway yesterday, and reports from the event point to new materials, 450mm and 3D ICs as the...
There's no place like SEMICON West for a company to make a major announcement. After all, it is the semiconductor...
Up until recently, I really hadn’t paid much attention to the the intricacies of memory types required to satisfy the...
STATS ChipPAC Ltd., semiconductor test and advanced packaging service provider, today held the groundbreaking ceremony for a new factory in...
I was on the phone with Herb Reiter yesterday, who told me he’d been busy this week thanks to the...
I did NOT see this one coming. For months, unconfirmed rumors have been flying about TSMC courting Apple, in hopes...
There’s been lots of news lately about the transition to 450mm wafers, and I’m wondering, is it only me, or...
Outsourced Semiconductor Assembly and Test (OSAT) provider, STATS ChipPAC Ltd., has announced qualification of its 300mm middle-end-of-line (MEOL) manufacturing operation for...
Some of the best news to read (especially on a Friday) is non-news, like this report by Ann Steffora Mutschler,...