The first European 3D TSV Summit (January 22-23, 2013) hasn’t even happened yet, and already its intended message is becoming...
In last week’s coverage of the Known Good Die Symposium, I talked about the notion of shifting focus from Known...
Ever since TSMCs Open Innovation Platform (OIP) event, we’ve been hearing all about how the company has qualified its 2.5D...
TechSearch International, Inc. announces that in celebration of its 25th anniversary the company partnered with IEEE Women in Engineering Committee...
After wrapping up a run of blog posts from two weeks of travel and 4 conferences,(IWLPC 2012, the IEEE 3D...
After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry...
Multi-Die Integration Provides Multifaceted Solutions By Francoise von Trapp, 3D InCites This year’s Roadmaps for Multi-Die Integration Symposium, hosted by...
The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a...
It’s been a whirlwind of conferences these past few weeks, and as a result, I have attended FOUR panel discussions...
Last week (November 6) STATS ChipPAC issued a press release announcing that its advanced eWLB provides a platform for 2.5D...
At last week’s 3D Test Workshop in Anaheim, CA, I had the pleasure of moderating a panel of industry experts,...
The latest digital issues of Chip Scale Review and iMicronews’ 3D Packaging magazines hit the virtual “stands” last week, and...
After listening to John Ellis, semiconductor industry veteran and author of the techno-thriller, The Dormant Curse, expound on the threat...
All Programmable PlanetToday All Programmable Planet’s newsletter appeared in my inbox, with a great post by Max Maxfield on the...
Today's 3D day kicked off with a very broad and thorough state-of-the-technology report from imec's perspective, presented by Paul Marchal. ...
Tomorrow's the big 3D day, but today's keynote from Nicolas Sillon of CEA Leti on "Silicon Interposer: Much More than...
While everyone’s waiting for the big memory houses like Micron and Samsung, and IDMS and foundries like IBM and TSMC...
Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down...
Georgia Tech Packaging Research Center (GT-PRC), through an industry consortium of about ~15 semiconductor, package and supply-chain companies from US,...
Glass interposers got a thumbs up from i-MicroNews in a “Closer Look” post reviewing Corning’s Peter Bocko’s presentation at IMAPS 2012. ...
