Product Description CoatsClean ER105 is a wet resist and residue remover that has been successfully used to remove post-Bosch and...
Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes...
Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies...
Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric...
Product Description Alchimer’s eG3D Polymer simplifies the metallization process flow for deposition processes for TSV insulation and barrier by combining...
Product Description The Virtex-7 H580T FPGA is the first 3D heterogeneous all programmable device, featuring up to eight 28 Gbps...
Product Description Synopsys’ Galaxy™ Implementation Platform is the industry’s leading solution for IC implementation and signoff. Now available with powerful...
It’s been an exciting month since we first announced that 3D InCites and TechSearch International established the 3D InCites Awards...
Product Description Dow Corning temporary bonding solution is a bi-material silicone based technology featuring low cost of ownership and room...
Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process...
Product Description CielSpot, CielSpot-CTM and CielMech are thermal and mechanical simulation Software As A Service (SAAS) products based on Cielution’s...
Product Description Cadence Encounter Test provides a comprehensive methodology for 3D-IC design-for-test and automatic test pattern generation that includes a...
Product Description The 2.5D & 3D Packaging Cost Model is the first tool available to model the total cost and...
Product Description Apache Design’s fourth-generation RedHawk™-3DX simulation software technology extends previous generations’ capabilities to address sub-20 nanometer (nm) designs with...
Product Description Mass metrology is the measurement of the mass change on a wafer as a result of a wafer...
Product Description Calibre enables signoff verification of chip stacks with flip chips, silicon interposers and through-silicon vias (TSVs). Verification of...
Product Description Triton Micro Technologies’ ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC...
Product Description The InStrip3D utilizes the experience gained from a well-established installed base of high-parallel InStrip/InMEMS solutions. The architecture of...
Product Description The NSX 320 Metrology Series combines macro inspection and 3D metrology for advanced packaging applications. The demonstrated 3D...
Product Description 2.5D Silicon Interposers form the base for the assembly of electro-optic engines for Chip-to-World Interconnects. These electro-optic engines...
