This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to...
At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally...
As advanced packaging facilities transition their manufacturing from round wafers to square panels, the JetStep S Series Lithography System is...
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
Last week, ASE and Inotera Memories announced they had entered into a joint development project (JDP) intended to both strengthen...
In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the...
My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of...
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has...
Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion...
The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about...
Design and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test...
Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of...
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than...
I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French...
An interesting take-away from the keynote talk delivered by Brandon Prior, Prismark Partners, at this year’s IMAPS International Device Packaging...
At IMAPS DPC 2014, which took place March 11-13, 2014, in Fountain Hills, AZ, there were several presentations focused on...
All hell broke loose at the 3D Panel discussion at the 2014 IMAPS International Device Packaging Conference. Nobody was hurt,...
Proceeds to Benefit STEM-based Scholarship Programs PHOENIX– March 18, 2014 – 3D InCites, the premier online content source for reliable...
Ladies and Gentlemen of the semiconductor industry, we have a new acronym to add to 3D integration lexicon and its...
