Seed layer deposition is one of the most critical process steps in manufacturing vertical and horizontal interconnects. At the panel...
Fan out (FO) packaging is one of the key growth segments in advanced packaging, with high adoption rates and strong...
EVATEC AG, a leading supplier of thin film equipment and process solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics applications,...
In a multi-stage process, the 13-person jury of experts of the Swiss Venture Club (SVC) chose Evatec as the winner...
LAYERS 5, from Evatec, is your guide to all the latest thin-film technology news across advanced packaging, semiconductor, 0ptoelectronics, and...