Testing the limits: standardization and optimization of chiplet test protocols Chiplets often come from different sources, making electrical testing challenging....
IEEE P3405: Chiplet Interconnect Test and Repair Working Group (CITR-WG) Sponsoring Society and Committee: IEEE Test Technology Standards Committee (TTSC)...
When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits...
Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful...
Virtually all scientific and industry forums on 3D have “3D design-for-test” and/or “3D test” on the topic list of their...