Bridging the gap: innovations in chiplet interconnect technology Chiplet interconnects begin with small chips – or chiplets – with a...
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling...
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather...
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is...
For the past 2 to 3 years, 3D integration technology has developed into a technically and economically interesting road for further...
