Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating ChemistryNov 19, 2015 · By Dow Electronic Materials · Press Releases MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today...
Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison AwardApr 28, 2015 · By Dow Electronic Materials · Press Releases MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today...
Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free BumpingOct 10, 2013 · By Dow Electronic Materials · Press Releases The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials...
