Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the...
The growing demand for semiconductors, from the cloud to the edge, from artificial intelligence (AI) to 5G communications, has exceeded...
As the power density increases for semiconductor devices, thermal management is becoming an ever more critical challenge for reliability and...
Thermal management is becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase...
As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue...
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics...
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing....
