Shield USA Project will strengthen U.S. semiconductor packaging capabilities The National Institute of Standards and Technology — part of the...
Advanced wafer-level packaging advances the next wave of innovation in global chip manufacturing TEMPE, Ariz. – March 19, 2024 –...
The CHIPS and Science Act aims to bring semiconductor research & development and manufacturing back to U.S. soil. Not only...
Founder’s Award honors individuals who have made the most significant contributions to the microelectronics packaging industry Tempe, Ariz. – October...
Nepes Laweh corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using...
Technology enables state-of-the-art onshore advanced packaging foundry services KISSIMMEE, Fla. and TEMPE, Ariz. – October 12, 2021 – SkyWater Technology (NASDAQ:...
TEMPE, Arizona – March 18, 2021 – Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction...
TEMPE, Arizona – Oct. 20, 2020 – Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing...
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand...
TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry,...
SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp....
Fully Automated Manufacturing Technology Drives Growth for WLP Startup Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry,...