Arnita Podpod

About Arnita

Arnita Podpod graduated with a master’s degree in Materials Science and Engineering and with a bachelor's degree in Applied Physics from the University of the Philippines. After graduation, she started at NXP Semiconductors as a Project (Materials) and Process Engineer and progressed to be a Senior Package Development Engineer with Fairchild Semiconductor Phils. Arnita joined imec in 2013 as a Senior R&D Engineer and is currently responsible for both Flip Chip on FOWLP projects and pre-assembly module integration within the imec 3D program.