Adeel Bajwa

About Adeel

Adeel received his M.Sc. and Ph.D. degrees in Microsystems Engineering from Albert-Ludwigs University of Freiburg, Germany, in 2012 and 2015 respectively. His PhD thesis focused on the development and characterization of assembly techniques for GaN and SiC devices. In November 2015, he joined the Center for Heterogeneous Integration and Performance Scaling (CHIPS), Department of Electrical and Computer Engineering, UCLA, as a postdoctoral fellow where he worked on the development of fine pitch interconnect techniques. Since November 2017, he is working for KnS in Advance Packaging Process R&D Department focusing on fluxless thermal compression bonding and ultra-fine pitch direct metal-metal bonding techniques.