3D PLUS

About 3D PLUS

Founded in 1995 in Buc, France, 3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. Its patented technology portfolio stars with standard package scale upward to die-size and wafer-level stacking processes, and enables stacking heterogeneous active, passive and Opto-electronics.

Comparing to other existing 2D traditional solutions, our technology allows gaining a factor of at least 10 on the weight and volume of the components. It responds to a diverse range of needs and requirements going from low volume-space qualified up to high volume-industrial applications.

Benefiting from high Quality standards based on the ISO9001 certification, our 3D stacking technology is the sole worldwide qualified by the European Space Agency (ESA) and the French Space Agency (CNES) for Space applications.

Our Solutions

3D PLUS products are used in high technology industries such as aerospace, defense, security and avionics. With more than 200,000 modules in space, and more than 22 years of flight heritage with no reported failure, we provide the global space and defense industry for all types of applications: telecommunications, Earth observation, navigation, launch and manned space vehicles, science missions and constellations.

3D PLUS offers a wide range of catalog radiation tolerant products for space applications including Memory and IP cores, Computer Cores, Interfaces, POL converters, Peripherals and Radiation Protection ICs and Camera heads. Industrial memory and Custom System-In-Package (SiP) solutions are also available for our customers who want to shrink their design thanks to our State-of-the Art stacking technology and recognized design, manufacturing and test expertise.

To learn more, visit www.3d-plus.com, or follow us on LinkedIn