EV Group, Author at 3D InCites

About EV Group

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners, and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

EV Group News - Page 4

EV Group Breaks Speed and Accuracy Barrier in Mask Alignment Lithography for Semiconductor Advanced Packaging

Mar 08, 2017 · By EV Group · Press Releases

FLORIAN, Austria, March 8, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...

Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program

Sep 21, 2016 · By EV Group · Press Releases

Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of...

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

Jul 14, 2016 · By EV Group · Press Releases

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

Jul 06, 2016 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey

Jun 21, 2016 · By EV Group · Press Releases

FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...

EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications

May 10, 2016 · By EV Group · Press Releases

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Advanced Packaging and 3D IC Market Driving Strong Growth for EV Group’s Automated 300mm Polymer Adhesive Wafer Bonding Systems

Aug 31, 2015 · By EV Group · Press Releases

ST. FLORIAN, Austria, August 31, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...

EV Group Receives 3D InCites Award for Gemini FB XT Automated Fusion Wafer Bonder

Aug 02, 2015 · By EV Group · Press Releases

ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS,...

EV Group Clears Key Barriers to 3D-IC/TSVs HVM with Breakthrough Fusion Wafer Bonding Solution

Jun 30, 2014 · By EV Group · Press Releases

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50...

EV Group Boosts 2.5D and 3D-IC/TSV Performance with New Nanospray Application

Mar 13, 2014 · By EV Group · Press Releases

ST. FLORIAN, Austria, March 12, 2014 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...

EV Group Unveils HVM Photoresist Processing System for Logic and Memory Advanced Packaging Applications

Feb 11, 2014 · By EV Group · Press Releases

ST. FLORIAN, Austria, February 11, 2014 — EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS,...

EV Group Completes Next Expansion Phase of Corporate Headquarters

Dec 09, 2013 · By EV Group · Press Releases

ST. FLORIAN, Austria, December 05, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...

Dow Corning Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D-IC Manufacturing

Sep 04, 2013 · By EV Group · Press Releases

Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3,...

EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging

Sep 04, 2013 · By EV Group · Press Releases

Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for...

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Jul 10, 2013 · By EV Group · Manufacturing

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST,...

EV Group Pushes the Limits on 3D-IC Manufacturing for Next-Generation CMOS Image Sensory

Jul 08, 2013 · By EV Group · Press Releases

Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density...

EV Group Enhances Wafer Debonding Solutions Portfolio with New LowTemp Room-Temperature Debonding Platform

Jul 01, 2013 · By EV Group · Manufacturing

Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater...

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

Jun 17, 2013 · By EV Group · Manufacturing

CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST....

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System for Micro-and Nano-Electronics Production

May 07, 2013 · By EV Group · Press Releases

Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor Applications SEMICON SINGAPORE, May 7,...

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