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IFTLE 597: Samsung Glass Substrates; Samsung SAINT

Samsung Announced Glass Substrates Effort Samsung Group’s electronics subsidiaries have announced a joint research and development effort between Samsung Electro-Mechanics and the group’s major electronics affiliates, including Samsung Electronics and Samsung Display to accelerate the commercialization of glass substrates to commercialize faster than semiconductor rival Intel in the U.S. Samsung...

U.S. Chips Funding

IFTLE 595: Updates On U.S. Chips Funding Awards

We’ve been following several stories on U.S. base expansion stories made possible by  U.S. Chips Funding Awards. Here is an update on three of them. NHanced Terminates Bloomington IND Expansion Plans We recently discussed NHanced Semiconductors‘ plans for expansion in Morrisville NC, Bloomington IND and Odon IND. This past week...

An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)

IFTLE 587: Intel Glass Core Substrate Update

In late Feb INEMI hosted a Packaging Tech Topic Webinar: Glass Substrates for Advanced Packaging which was presented by Dr. Dilan Seneviratne and Dr. Gang Duan of Intel Corporation. Dilan Seneviratne is a Principal Engineer and Director of Dielectrics and Surface Prep Area within Intel’s Substrate Packaging Technology Development organization....

Glass Core Substrates

IFTLE 575: Intel’s Interest in Glass Core Substrates

Intel recently announced that it would use glass core substrates for advanced packaging in the second half of this decade. The company reports it has been researching and evaluating the reliability of glass core substrates as a replacement for organic substrates for more than a decade. Intel says that it...

The Rise of Organic and Glass Substrates

If you are designing a heterogeneously integrated, multi-die, high-performance device for markets such as HPC, AI, data centers, etc., then the silicon interposer is probably the platform of choice. Yes, it comes at a cost, and generally requires expensive silicon place-and-route (P&R) tools, along with workflows for implementation. With the...

IFTLE 512: SKC Announces Glass Substrates for BGAs; TSMC Expands Packaging

Over the past several years many companies have been extolling the virtues of glass as a packaging medium. Corning Glass, Schott Glass, and Asahi Glass have spent considerable funds on such endeavors. At the 2013 GaTech Interposer conference, for instance [ see IFTLE 180 “GaTech Interposer Conf ; Glass and...