The EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), will feature manufacturing and supply chain trends for semiconductor packaging, assembly, and test in Europe. Themed Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing? , the third edition of the workshop will showcase collaboration among Outsourced Semiconductor Assembly and Test (OSAT) providers and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs) that is instrumental for the resilience of Europe’s microelectronics industry. Registration is open.
This year’s EuroPAT Workshop will be hosted by Swissbit Germany AG on day one and the Mercure Hotel MOA on day two. The workshop will present a broad scope of topics including:
- Packaging, assembly and test manufacturing in Europe
- The role of European OSATs and SPAT-SPs
- Semiconductor packaging supply chain
- EU Chips Act updates for packaging
- Coordination and Support Action (CSA) and Pack4EU Chips Joint Undertaking (Chips JU) updates
- European markets and applications strengths and weaknesses
- Technology transfer from pilot lines in RTO and industrial pilot lines
- Collaboration in open advanced packaging piloting facilities
Global Industry Leaders to Attend
The EuroPAT Workshop participating companies include experts from global leaders:
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