Binghamton University, GE Aerospace, and IBM Research are proud to host the 35th Annual Electronics Packaging Symposium — Small Systems Integration. The program will include two days of exciting invited presentations with a focus on supply chain interconnectivity.
We invite you to join us for this event on Sept. 4-5, 2024, at Binghamton University’s Innovative Technologies Complex. We look forward to seeing you in person.
The symposium brings together leaders in academia, industry, and government to network and discuss the latest advances in the field of electronics packaging, and to bring value from the varying viewpoints of each respective sector.
The program will also include keynote presentations and student poster sessions. The goal of the symposium is to have those who attend walk away with insights, career-building opportunities, and the knowledge of having been an integral part of the advancement of the electronics packaging field.
Session topics will include the future of computing for HPC/AI, flexible, additive, and wearable electronics, heterogeneous integration, photonics packaging, thermal challenges, advanced substrates, and power electronics.
A special panel on the expansion of the electronics industry into India, chaired by Rao Tummala.
The event will include a special workshop on metrology hosted by NIST.
