Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver two technical presentations at the 11th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing (MiNaPAD) Forum, taking place June 19-20 in Grenoble, France.
On June 19, Lim will discuss innovative interconnect materials for semiconductor assembly and advanced packaging, particularly for small form factor modules, including solder paste for ultra-fine pitch printing, solders with various melting temperatures for hierarchical soldering, novel ultra-low residue no-clean flux formulations for flip-chip attach that are compatible with underfill and molding compounds, and an adhesive agent for fluxless soldering with a formic acid atmosphere. As advanced packaging continues to drive toward heterogeneous integration, new materials need to be developed to address the many challenges faced in the assembly process.
On June 20, Lim will share the findings from an iNEMI joint collaboration project involving various companies. The presentation will explore the effects of voids on solder joint reliability in first-level interconnect (FLI) by examining the results of three different reliability tests. With the emergence of advanced packaging technology and heterogeneous integration, micro Cu-pillar bump is widely used as FLI. Micro voids are often found in this kind of FLI flip-chip attach and there are limited insights on the effects of voids on the reliability of the flip-chip solder joint.
As the Senior Global Product Manager for Semiconductor and Advanced Materials, Lim works closely with the R&D and manufacturing teams and collaborates with leading semiconductor companies and contract manufacturers around the world. She is a task force member of the International Electronics Manufacturing Initiative’s (iNEMI) Packaging Technology Integration Group and has co-chaired several industry projects and road mapping initiatives over the past five years. She is also a member of the executive committee of the Institute of Electrical and Electronics Engineers (IEEE) Packaging Society Malaysia Chapter. Lim is a part of the organizing committee for the International Electronics Manufacturing Technology (IEMT) and has authored several technical papers. She regularly presents at international technical conferences. Lim earned her bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus on polymers. She is a Certified SMT Process Engineer and has earned her Six Sigma Green Belt.
