Presentation abstracts are now being accepted for the Advanced Packaging Conference, Fab Management Forum, and MEMS & Imaging Sensors Summit
SEMI Europe today announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2024 will gather industry-leading experts and innovators to explore cutting-edge technologies, materials, and process advancements driving the digital transformation and growth in the semiconductor industry. The exhibition and conference will be co-located with Electronica.
Call for Abstracts – Events
Advanced Packaging Conference ─ Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency
The emergence of new types of neural networks like ChatGPT and other AI applications is driving unprecedented demand for high-performance computing (HPC) and innovations in advanced packaging – including for chiplets – heat dissipation, miniaturization, material integration, and power optimization. Abstracts on topics including growth through innovation, developments in design, manufacturing efficiency, and testing systems are invited.
Fab Management Forum ─ Industry Meets Innovative Ideas
Geared for fab managers, the Fab Management Forum will focus on optimizing next-generation core technologies such as SiC, photonics, and quantum computing to support industry growth. The forum will explore advancements in smart manufacturing solutions that leverage AI-driven tools for efficiency gains to address Europe’s environmental sustainability goals and mitigate semiconductor industry-related environmental risks.
MEMS & Imaging Sensors Summit ─ MEMS and Imaging Young Talent
Entrepreneurs, start-up companies, and graduates will showcase their research and early-stage products to MEMS and imaging sensors technologists. Topics of interest include MEMS technologies, new applications and use cases, advancements in MEMS and sensors technology and materials, MEMS-photonics co-integration, and imaging technologies focused on new sensor applications, materials, and architectures.
Pre-recorded Innovation Presentations ─ Innovation and Collaboration: Powering Sustainable Exponential Growth
SEMI Europe will also highlight microelectronics and semiconductor innovations in short pre-recorded messages, pitches, and product announcements by technologists. The videos will be aired on SEMICON Europa 2024 main stages during networking sessions and on the final day of the event.
Presentation abstracts, biographies, and headshots must be submitted in English on the SEMICON Europa 2024 Call for Abstracts webpage by June 17, 2024. Selected presenters will be notified in August 2024.
For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#SEMICONEuropa).
