Brewer Science, a global technology leader in specialty materials for compound semiconductor manufacturing, invites attendees of CS Mantech to visit Booth 316 to explore cutting-edge material solutions designed to address the unique challenges of compound semiconductor manufacturing.
Unique Material Challenges for Compound Semiconductor Manufacturing
Compound semiconductor manufacturing poses unique material challenges due to the complex nature of these materials. Addressing these challenges is crucial for optimizing device performance and reliability in technologies like 5G communication and high-power electronics. Innovative material solutions tailored to compound semiconductor manufacturing are essential for advancing semiconductor technology and enabling the development of cutting-edge electronic devices.
Challenges faced in compound semiconductor manufacturing include:
- Etch selectivity and final patterning
- Feature size control versus absolute resolution
- High energy and dose implantation
- Patterning over topography
- Wafer handling and high topography
- Insulation dielectrics
- Specialty solvent and custom materials
“Applications in compound semiconductor manufacturing require expertise in material attributes: defects, etch selectivity, thermal management, and final patterning,” states Alex Smith, Executive Director of Business Operations at Brewer Science. “We are excited to share our expertise in this area and showcase our latest innovations at CS Mantech.”
Expertise in packaging solutions and lithography materials is required to address compound semiconductor applications
Brewer Science leverages over four decades of expertise in both wafer packaging solutions and advanced lithography materials to bring customers a truly innovative approach to compound semiconductor needs.
At CS Mantech Booth 316, attendees will have the opportunity to learn about Brewer Science’s advanced BrewerBOND® materials for mechanical and laser debonding, including the VersaLayer system, a set of materials offering versatile, high-thermal-budget solutions for temporary bonding and debonding. Additionally, BrewerBOND® materials for mechanical and laser debonding will be showcased, alongside material solutions for thermal slide and chemical release debonding methods. For permanent bonding needs, Brewer Science offers PermaSOL® materials, providing robust and reliable solutions for various applications. Members from the team will be at the event to discuss how these innovative material solutions can be tailored to meet specific application requirements.
In addition to booth demonstrations, Brewer Science will host a presentation titled “Innovative Material Solutions for Compound Semiconductor Manufacturing” in Tucson Room C at 12:30 pm – 12:40 pm on Tuesday, May 21. This presentation aims to provide valuable insights into addressing the challenges of compound semiconductor manufacturing, including applications in wafer-level packaging solutions and advanced lithography materials.
