As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while also addressing sustainability issues and investing in STEM education. From pioneering product debuts and events to strategic alliances and efforts in workforce development, our members had lots of news to share. Here is our monthly dive into the notable highlights of our member news, events, and advancements from the past month.
Celebrating Sustainability on Earth Day
Brewer Science proudly announces its ninth consecutive Zero Waste to Landfill Certification, showcasing its dedication to responsible waste management. The company’s sustainability objectives, including achieving a Net Zero Carbon Footprint by 2050 and reducing greenhouse gas emissions, demonstrate its ongoing efforts towards environmental responsibility.
In celebration of Earth Day, the company invited individuals to explore its new Sustainability Outreach Program, which comprises four self-paced modules: Define Targets, Design Infrastructure, Manage Resources, and Measure Impact. The program engages stakeholders in environmental initiatives, complemented by its Green Chemistry Program and community recycling efforts. All this is showcased on its “Going Green” page to inspire wider adoption of sustainable practices in the tech industry.
Cadence commemorated Earth Day at its headquarters by hosting a gathering where company leaders and partners discussed Cadence’s collaborative efforts with teams and communities to foster sustainability. Employees engaged in volunteer activities, packing over 4,000 hygiene kits in partnership with Clean the World.
Technology Advancements
Henkel introduced Loctite Eccobond UF 9000AE, a semiconductor capillary underfill encapsulant specifically designed for advanced packages used in artificial intelligence (AI) and high-performance computing (HPC) applications. This innovative material provides robust protection for large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices, addressing the challenges of bump protection and warpage control. Henkel’s commitment to semiconductor packaging innovation is evident in its continuous efforts to provide solutions that meet the evolving demands of the industry, particularly in the realm of AI and HPC technologies.
In his blog for SemiWiki, Mike Gianfagna highlighted MZ Technologies as a unique company offering critical planning and analysis tools for multi-die design, positioned above the traditional EDA design flow. He emphasized that GENIO™, under a given set of constraints, yields favorable results. Additionally, he posed thought-provoking questions about the optimal set of constraints, stack types for 3D, interposer types for 2.5D, and block and pin placement for achieving optimal outcomes.
Trymax Semiconductor Equipment B.V. announced it has received multi-system orders for its NEO 2400 series and NEO2000UV from a major Asia-based foundry. Peter Dijkstra, CCO of Trymax, expressed confidence in the company’s commitment to delivering high-quality products that meet industry demands. The NEO 2400 series production platform and NEO2000UV tools, the latest additions to Trymax’s NEO range, offer advanced plasma solutions for various processes.
Brewer Science, Inc., unveils its latest innovation; the Smart Warehouse Monitor system, aimed at enhancing workplace safety and productivity in industrial settings. This integrated platform reportedly detects maximum weight capacity in boxes, ensuring safety compliance. Key features include on-demand monitoring, tailored solutions, compliance assurance, and productivity enhancement.
SEMI continued its praise for the U..S. Department of Commerce’s support of chip manufacturing companies that were awarded significant grants, loans, and tax credits under the CHIPS and Science Act. These included TSMC-AZ, Samsung, and Micron. Joe Stockunas, SEMI Americas President, highlighted the economic and job creation benefits, emphasizing government backing in semiconductor manufacturing. The SEMI Fab Outlook report underscored the growing investment in 300mm fab equipment in the Americas, positioning the region as a key player in chipmaking. Visit SEMI Global Advocacy and SEMI Workforce Development for more on policy efforts and talent needs in the microelectronics industry.
Collaboration
ERS Electronic GmbH, the provider of thermal management solutions for semiconductor manufacturing, solidified an agreement with Geringer Halbleitertechnik GmbH & Co. KG to enhance its research, development, and production capabilities. Geringer, renowned for tailored manufacturing machines in the semiconductor industry since 1991, brings its experienced team and facilities in Barbing under the ERS umbrella, forming ERS Barbing, a dedicated hub for ERS’s Advanced Packaging Equipment Solutions (APEqS) Business Unit. This strategic partnership aims to bolster innovation and production efforts, exemplified by ERS’s latest products, the Wave3000 and Luminex lines.
Amkor Technology, Inc. announced a multi-year partnership with Infineon to establish a dedicated packaging and test center at Amkor’s manufacturing site in Porto, Portugal, strengthening their outsourced backend manufacturing footprint in Europe.
Expected to begin operations in the first half of 2025, this agreement extends their collaboration in the semiconductor assembly and test sector. Amkor will expand its facilities, while Infineon will provide onsite engineering and development support, enhancing the European semiconductor supply chain resilience, particularly for automotive customers.
This partnership underscores Infineon’s commitment to Portugal’s semiconductor ecosystem and contributes to the region’s significance in semiconductor manufacturing. Giel Rutten, Amkor’s president and CEO, emphasizes the collaboration’s role in enhancing supply chain resiliency for advanced products supporting automotive and industrial end markets.
At the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced successful collaboration milestones with TSMC, achieving multiple new product certifications for TSMC’s latest processes. These certifications enable mutual customers to develop innovative end-products using industry-leading EDA software and advanced packaging technologies. Siemens’ Calibre® nmPlatform tool and Analog FastSPICE platform are now certified for TSMC’s advanced processes, supporting early adopters seamlessly. The collaboration extends to 3D-IC design-for-test implementations and thermal analysis, reinforcing Siemens’ commitment to enhancing the TSMC ecosystem. TSMC recognizes Siemens as a strategic partner, anticipating further innovations to support customers’ leadership in HPC and AI.
Workforce Development
SEMI Foundation expanded its SEMI University learning platform to include in-person training sessions, aiming to address the global semiconductor talent gap. These courses, alongside existing online offerings, cater to technicians, engineers, and non-technical personnel seeking career advancement. Covering topics such as manufacturing operations, chip design principles, and emerging technologies like AI and MEMS, the in-person training begins at SEMI headquarters in Milpitas, California, with future sessions planned at SEMICON West 2024 in San Francisco. Naresh Naik, SEMI University Director, emphasizes the platform’s focus on industry needs, offering practical skills and knowledge for career growth. With topics ranging from silicon substrate preparation to MEMS product development, SEMI University aims to bridge the semiconductor industry’s skills gap and promote workforce development through a comprehensive program of online and in-person training initiatives.
Megan Faust, Chief Financial Officer of Amkor Technology, Inc., recently addressed students at the W. P. Carey School of Business – Arizona State University. Her presentation offered valuable insights into corporate strategy, governance, and sustaining competitive advantages. Megan underscored the importance of strategic decision-making and shareholder communication for large public companies. Through sharing her expertise and real-world experiences, she provided students with a comprehensive understanding of the business and financial challenges companies encounter.
Fraunhofer IZM celebrated the participation of female students in its annual Girls’ Day activities. They were excited to offer these students insight into microelectronics alongside researchers. Throughout the day, they explored topics like sustainable batteries from fruit, circuit boards, and smartphone composition, and engaged in hands-on activities like soldering and smartphone dissection.
Celebrations and Events
Evatec AG celebrates 20 years of innovation. Since its foundation as a management buy-out in 2004 with just five employees, the company now boasts a team of 600 employees worldwide. This global team supports customers daily with production tools and processes that enable new technologies for connectivity, mobility, computing, energy efficiency, and smart sensing. The company expresses gratitude to all its customers for the long-term collaboration and partnerships developed together. With the pace of technology changes accelerating even more, the company looks forward to embracing all the opportunities the next 20 years will bring.
In addition to a fantastic presentation from Cadence CEO, Anirudh Devgan, CadenceLIVE also featured ASE’s Mark Gerber, who shared advanced packaging perspectives and highlighted the importance of collaboration between the design and advanced packaging communities as automotive, AI, and digital biology applications evolve.
EV Group will participate in the upcoming International VLSI Symposium on Technology, Systems, and Applications (VLSI TSA) in Hsinchu, Taiwan. Ksenija Varga from EVG will showcase a poster presentation titled “Semiconductor Traceability: Die Annotations Patterning by Maskless Exposure Technology,” highlighting how this application is simplified with the use of EVG’s LITHOSCALE™ Maskless Exposure System.
At the 2024 MRS Spring Meeting & Exhibit Onto Innovation’s Andy Antonelli presented “Pathfinding in Optical Critical Dimension Metrology.” Antonelli delved into optical critical dimension metrology techniques operating in the mid-infrared to tackle challenges associated with high aspect ratio structures.
Awards and Certifications
Nordson Electronics Solutions was honored with the conformal coating equipment award from EM Asia China for its ASYMTEK Select Coat SL-1040 system, unveiled in November 2023. Designed for high-volume printed circuit assembly, the SL-1040 features advanced automation and precision, catering especially to automotive electronics. The system’s innovative features, cost-effectiveness, speed improvements, quality contribution, and ease of use were recognized, making it a pivotal advancement in conformal coating technology for electronics manufacturing.
QP Technologies announced its certification as ANSI/ESD S20.20-compliant by TÜV SÜD America Inc., affirming its adherence to electrostatic discharge (ESD) control standards. ESD poses a significant threat to electronic products, making documented processes for monitoring and control vital. Following an intensive audit of its Escondido facility, QP Technologies’ IC packaging and assembly line were confirmed as ESD-safe. The certification underscores the company’s commitment to quality and safety, aligning with its recent ISO 9001:2015 and ISO 13485:2016 certifications.
People on the Move
Patric Schoch, Evatec’s new CFO, brings extensive experience, including a decade in Asia and a recent tenure as Group CFO for a Swiss-listed company. He aims to shape Evatec’s future and financial strategy, prioritizing stability, liquidity, and business growth. Schoch emphasizes understanding the company, its products, and customer needs, aiming to foster trust and respect within the team. His personal goal is to contribute significantly to Evatec’s success while nurturing and developing its people.
ACM Research recently hired Ken Thorn as its new IT infrastructure manager.
After planning and attending the 2024 sales conference in Vietnam, Onto Innovation recently promoted Olivia Hackney to marketing communications specialist.
Ajinomoto Fine-Techno USA Corp promoted Habib Hichri to Executive Vice President, Senior Fellow, Global Applications and Business Development.
Career Opportunities
3D Plus is recruiting an Analog Electronic Design Engineer F/M. Are you familiar with electronics and interested in space? Apply directly here.
Onto Innovation is hiring a new Product Marketing Director (Metrology Products) in the United States. Apply today
YES is hiring a new Process Engineer in Chandler, Arizona. Apply today.
Keep Us Posted!
While we’re always on the lookout for member news to share, sometimes we miss things. If you’re a member company (or work for one!), be sure to send us your news throughout the month so we can feature it in our monthly wrap-up.
