Presenting the 2024 3D InCites Awards Finalists. The 2024 3D InCites Awards celebrates excellence in heterogeneous integration, 3D HI, and chiplet technologies; sustainability; diversity, equity, and inclusion (DEI); and the Best Place to Work. Companies submitted applications for each category described below.
The Advanced Technology Enablement Awards recognizes efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. Technology Enablement Award applications were reviewed by the Member Advisory Board who selected eight finalists.
The 3D InCites Sustainability Award is presented to a company demonstrating best practices in sustainable semiconductor manufacturing. Applications were reviewed by our Sustainablity Award Committee: Dean Freeman, Chief Analyst, Freeman Technology and Market Advisors; Julia Goldstein, Owner, JLFG Communications and Author of Material Value; and Mousumi Bhat, Ph.D., Vice President, Sustainability Programs, SEMI.
The Adele Hars Award for DEI is presented to a company demonstrating best practices in Diversity, Equity, and Inclusion. Applications were reviewed by the DEI Award Committee: Margaret Kindling, SEMI Foundation; Joanne Itow, SEMICO Research; and Veronique Pequignat, Director of International Actions, Invest in Grenoble Alpes.
The Best Place to Work category will be decided by an online vote. Voting opens Tuesday, January 9, 2024, and concludes on January 31, 2024.
Winners of the 2024 3D InCites Awards will be announced on February 7, 2024. Awards will be presented in a ceremony during the IMAPS Device Packaging Conference on March 19, 2024, at 9:55am after the Keynote Sessions.View the 2024 3D InCites Awards Finalists by category below:
