It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in the advanced packaging space. That space was generally left to the IMAPS Device Packaging Conference in March. It was evident in the sessions as well as the exhibit halls.
But this year’s program cover headline for IMAPS 2023 Symposium reads: “The dawn of the Chiplet Era to address emerging HPC, AI and Automotive and other end markets.” That this annual conference now covers the spectrum of packaging speaks to the fact that once a package is qualified in, it never goes away. As ASE’s C.P. Hung noted in his keynote presentation, “We now offer a spectrum of opportunities to give package designers the ability to provide the most efficient solutions for their customers.” That statement is true not only for ASE but for IMAPS as well.
From wire bond to flip chip, fan-out to 2.5D interposers, and 3D ICs to chiplet architectures, IMAPS 2023 delivered the latest industry trends and technology advancements. Whether you were there to attend the sessions, check out what the exhibitors were showcasing, or catch up with colleagues, you did not leave empty-handed, but with a wealth of knowledge and inspiration.
Just Say Yes to IMAPS
I think what most impressed me about this year’s event was the spirit of camaraderie that comes with being a member of this Society. I was honored to attend the all-new Leadership Gala, which highlighted the important roles played by all the volunteers who devote time and energy outside of their day jobs to make IMAPS successful, decade after decade.
From Nicole Wongk (IMAPS Foundation’s Steve Adamson Student Recognition Award winner) and Robin Davis (Emerging Leadership Award winner); to Susan Trulli (Lifetime Achievement Award Winner), and John Hunt (Daniel C. Hughes Jr. Memorial Award winner), this year’s recipients represented the full spectrum of the microelectronics industry. Their heartfelt speeches showed how important IMAPS is and has been to their personal career paths.
The full list of winners:
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- Lifetime Achievement Award – Susan Trulli
- Daniel C. Hughes, Jr. Memorial Award – John Hunt
- William D. Ashman/John A. Wagnon Technical Achievement Award – Johan Liu
- Sidney J. Stein International Award – Jens Mueller
- Leadership Awards – Jim Will
- Fellow of the Society – Tom Terlizzi
- Outstanding Educator Award – Robert Dean
- IMAPS Foundation’s Steve Adamson Student Recognition Award – Nicole Wongk
- Emerging Leadership Award – Robin Davis
- Corporate Recognition Award – Deca Technologies
- President’s Awards – Rich Rice
Congratulations to all, and especially to those who are also part of the 3D InCites community – Deca and ASE. This just shows that wherever you are in your microelectronics career, membership and participation in IMAPS enriches your journey and allows you to make personal connections that will last a lifetime.
