Dear Semiconductor / EDA expert,
In my role as business development consultant, I, Herb Reiter, am getting involved in many new technologies, interesting business opportunities and meeting influential people – like 3D InCites’ Francoise von Trapp.
At last week’s 3D ASIP Conference in California, Francoise offered to encourage you to answer a brief survey that will help Si2 and me, in my role at Si2, to better serve market requirements by strengthening design flows for interposer- and 3D-ICs.
If you have already integrated multiple dies in one IC package, or plan to utilize the many benefits of this powerful technology, please spend 15 minutes completing this Si2 survey to give us your feedback BY JANUARY 16, 2015 – either anonymously or, if you share your email address with us, we can and will share the survey analysis results with you.
HAPPY HOLIDAYS and a Successful 2015! ~ Herb Reiter, Director 3D-IC Programs at Si2
