Map Unavailable
May 23-24, 2023
Marcus Nanotechnology Research Center, Atlanta, USA
The Glass Packaging Workshop 2023 (GPW 2023), co-sponsored by IEEE, brings together researchers, designers, developers, users, and supply-chain manufacturers to share the latest advances in glass packaging.Glass panel packaging promises to address a variety of strategic needs: a) In HPC for higher performance, lower cost, and improved reliability; b) In automotive for improved high temperature reliability; c) In wireless for 6G for integrated antennas; d) In consumer electronics for ultra-miniaturization and lower cost. To enable all these, a global manufacturing ecosystem needs to be set up from R&D to manufacturing to enable the above products and applications.
Highlights
- Glass panel packaging promises to address a variety of strategic needs.
- The most leading-edge packaging currently is wafer-based Silicon BEOL packaging.
- These R&D activities led to the demonstration of industry’s 1st panel scalable RDL to 1 micron.
