The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023
IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference (CHIPcon). As the world’s leading semiconductor companies continue to push the edge of process technology, the industry is seeing a marked shift in device design and architectures to overcome economic and time-to-market challenges. The conference name change is the result of the rapidly rising adoption of chiplet-based device architectures, and the increasingly critical role packaging technology is taking in the manufacture and enablement of these advanced products.
The IMAPS CHIPcon conference will be held July 24-27, 2023, at the DoubleTree by Hilton San Jose in San Jose, California, and will focus exclusively on innovative device integration technology developments, solutions, and business trends. The program will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, high-performance computing and networking market segments. Speaker opportunities are by invitation only from the technical committee.
Advanced CHIP technology is an umbrella term that covers a variety of packaging technology subsets, including laminate/glass/ ceramic/silicon/leadframe based SiP, FanOut RDL, 2.5D/3D Heterogeneous Integration, and modules.
CHIPcon will explore the current state-of-the-art and emerging packaging technology roadmap supporting the integration and delivery of a complete system or subsystem solution. Attendees will be exposed to thought-provoking advanced package structures with high functioning system performance, mechanical reliability, thermal management and high-yield manufacturability.
The CHIPcon website can be found at: www.chipcon.org
About IMAPS
The International Microelectronics Assembly and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Worldwide, IMAPS offers educational and marketing opportunities for industry professionals, packaging organizations, and students through technical conferences and workshops, professional development courses, a microelectronics packaging research library, local chapters and exhibitions. The Society encompasses a wide-range of technologies and topics critical to microelectronics assembly and packaging, including: on-shoring, heterogenous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more.
