EMG Webinar: Preparing for Heterogeneous Integration Disruption

Join us for a closer look as industry experts discuss how material suppliers are responding to this dynamic technology environment.

The Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry to move beyond CMOS scaling, identifying difficult future challenges and potential solutions. New activities, such as MRHIEP, take the Roadmap a step further into how manufacturing and packaging processes will change and advance. Heterogeneous Integration is and will be the key technology direction going forward.

As we approach the inflection point of explosive expansion of innovations and electronic products into our global society, and the plateauing of CMOS’s scaling advantage, continued progress now requires a different phase of innovation.
Register now as SEMI Electronic Materials Group (EMG) prepares you for the semiconductor materials ecosystem disruption caused by the move to Heterogeneous Integration.

Join Brewer Science, TechSearch and EMD Electronics to take a closer look.