3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview

The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with a focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond. On Monday, October 3, IMAPS will be hosting a special Advanced Technology Workshop:  STRATEGIES TO REVITALIZE THE ON-SHORE PACKAGING AND ASSEMBLY DEFENSE INDUSTRIAL BASE. This one-day workshop is dedicated to the discussion of strategies to improve On-Shore Packaging and Assembly Capabilities. The IMAPS 2022 Symposium will follow the workshop, October 3-6, at the same location.

The Workshop and entire IMAPS program is stacked with representatives from our 3DInCites community. At least 25 member companies will be speaking, presenting and or exhibiting during the week. Here is the best compilation of who, what and where:

Workshop Technical Session Speakers

9:35-10:00am

The Evolution of Moore’s Law through Chipletized Architectures 
Tony Trinh, Mercury Systems

2:00-2:25pm

Panel Discussion: Onshoring Advanced Substrates & Materials

Meredith LeBeau, Calumet Electronics;

Habib Hichri, Ajinomoto USA;

Mike Gleason, GreenSource Fabrication

2:40-3:05pm

When Chips Become Systems

John Park, Cadence

3:05-3:30pm

Heterogeneous Integration of III-V Devices:  Successes and Challenges

John Lannon, Micross

IMAPS WELCOME RECEPTION

Open to all IMAPS 2022 & On-shoring Workshop participants

Monday, October 3 – 7:00 pm – 8:00 pm

EQUITY vs. EQUALITY IN THE WORKPLACE

Chair: Robin Davis, Deca Technologies
Committee: Erica Folk, Northrop Grumman; Beth Keser, Intel; Dan Krueger, Honeywell; Urmi Ray, iNEMI; Nicole Wongk, Honeywell

This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today‘s challenging work environment, including the important differences between equity and equality in the workplace.

PANELISTS:

KT Moore, Cadence Design Systems – VP Corporate Marketing & Business Development
Shelby Nelson, Mosaic Microsystems – Chief Technical Officer
Urmi Ray, Saras Micro Devices – Chief Technology Officer
Jean Trewhella, GlobalFoundries – Director of PostFab New Product Introduction

October 3, 2022

Monday Professional Development Courses

The 2022 PDC courses are offered on Monday, October 3, prior to IMAPS 2022. Registration required.

8-10am
PDC AM2:Semiconductors in Automotive – Technology Trends and Reliability – Pradeep Lall, Auburn University & Vikas Gupta, ASE

PDC AM3: Flip Chip Tech – Mark Gerber, ASE US, Inc.

1-3pm

PDC PM1: Fan Out for Advanced Packaging Applications – John Hunt, Senior Advisor & Jan Vardaman, President, TechSearch International, Inc

PDC PM2: System-in-Package (SiP) – System Solutions Through Miniaturization – Mark Gerber, ASE US, Inc

PDC PM3: Fundamentals of Thermal Management – Rita Mohanty, Sr. Scientific Principal, Henkel Corp.

The IMAPS 2022 Technical Committee has helped recruit more than 100 speakers around the following track and session topics. The full technical program includes 20 sessions, 12 PDCs, 5 keynotes, posters and panels.

October 4, 2022

Tuesday Technical Sessions

1:15-1:40 pm

TPM2 – WAFER-LEVEL-FAN-OUT AND ADVANCED RDL

Inspection Solution for 2um RDL from Wafer-Level to Panel-Level Fan-out Process
Leon Lin, Onto Innovation (Anderson Liu; Jay Chen; Maruko Wu; Cheolkyu Kim; Zhuan Liu)

1:45-2:10 pm

TPM1 – DESIGN, MODELING & SYSTEMS SIMULATION

An Organic Package Designer’s Guide to Transitioning to FOWLP and 2.5D Design
Bill Acito, Siemens EDA

TPM3 – EXTREME ENVIRONMENT

Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic Device
Yuan Zhao, Henkel Corporation

2:15-2:40pm

TPM3 – EXTREME ENVIRONMENT

A Lead-Free Lower-Temperature Solder Paste for Wafer-Level Package Application
Hongwen Zhang, Indium Corporation (Tyler Richmond)

3:45-4:10pm

TPM5 – ADVANCE PROCESSES AND MATERIALS

Substrate Surface Chemistry –  Insights To Understanding Adhesive Performance
Doug Katze, Henkel Corporation

4:15-4:40pm

TPM3 – EXTREME ENVIRONMENT

Silicone Migration Risks and Mitigation in Thermal Materials
Sanjay Misra, Henkel Corporation

TPM5 – ADVANCE PROCESSES AND MATERIALS

An Evaluation of Bath Life Effects on Photoresist Removal for Wafer Level Packaging
Joel Bahena, Veeco Instruments

4:45-5:10pm

TPM2 – WAFER-LEVEL-FAN-OUT AND ADVANCED RDL

Commercialization of Micro-Transfer Printing for III-V Heterogeneous Integration
David Gomez, X-Celeprint

Wednesday Technical Sessions

10:15-10:40am

WAM1 – ADVANCED MATERIALS

A Drop-in High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications
Hongwen Zhang, Indium Corporation (Tyler Richmond)

11:15-11:40pm

WAM1 – ADVANCED MATERIALS

Advancements, Versatility, and Flexibility of Dual-Layer Material System for Advanced Packaging Applications
Luke Prenger, Brewer Science, Inc. (Andy Jones; Dongshun Bai; Matt Koch)

WAM5 – POWER SUBSTRATE TECHNOLOGY

Understanding Criticality of Thermal Performance in Thermal Interface Material Applications
Rita Mohanty, Henkel Corporation (John Prindl)

1:30-1:55pm

WPM3 – INVITED SESSION: HETEROGENEOUS INTEGRATION ROADMAP

Intro to heterogeneous Integration Roadmap
Bill Chen, ASE: Tim Lee, Boeing

2-2:25pm

WPM4 – FLIP CHIP

Optimization of the Microstructure for Copper-to-Copper Direct Bonding by Electrodeposition Processes
Ralf Schmidt, Atotech Deutschland GmbH

5-5:25pm

WPM3 – INVITED SESSION: HETEROGENEOUS INTEGRATION ROADMAP

Automotive

Vikas Gupta, ASE

6:30-7:30pm

Panel Session: Developing Nest Generation MMWave Packages: What do we need?

Moderator:
Jan Vardaman, TechSearch International

While 5G handset sales continue to increase, the slow rollout the 5G infrastructure continues.  Over the next few years, the 5G rollout will be complete, but at the same time the industry is starting to discuss the requirements for 6G.  There are already concerns about material requirements, antennal design, assembly, and test.  Packages that can handle the higher frequencies are anticipated for mobile devices, small cells, infrastructure, automotive, and defense.  What frequencies are being targeted in each of these areas and what should the focus be for package development?  Are there areas that the industry ecosystem should address? With the promise of 5G, and eventually 6G, more data will be collected, stored, and shared.  Will our current datacenter structure support all the processing of the increased data expected with 5G and 6G?  What new package developments are required?  This panel of experts will discuss the development of next generation packages and needs to be addressed.

Thursday Technical Sessions 

9:30-9:55am

THAM4 – HETEROGENEOUS INTEGRATION

Using ADKs to enable early-stage chiplet-to-chiplet  interface compliance
John Park, Cadence Design Systems, Inc. (Ken Willis)

THAM5 – NOVEL INTERCONNECT METHODS

A Hybrid Pressure-less Silver Sintering Technology for High-power Density Electronics
Yuan Zhao, Henkel Corporation (Bruno Tolla; Douglas Katze)

10-10:25am

THAM1 – MANUFACTURING / PROCESS OPTIMIZATION

Investigating Optimal Process Parameters for Ultra-Fine Solder Paste Printing in SiP Assembly
Evan Griffith, Indium Corporation (Casey Rowland; David Sbiroli; Jonas Sjoberg)

THAM2 – MANUFACTURING CONSIDERATIONS

Fabrication of Panel-Level Glass Substrates with Complete Design Freedom using LIDE
Rafael Santos, LPKF Laser & Electronics (Nils Anspach; Norbert Ambrosius; Stephan Schmidt; Roman Ostholt)

10:30-10:55am

THAM4 – HETEROGENEOUS INTEGRATION

Glass interposers with through-glass vias for heterogeneous integration
Shelby Nelson, Mosaic Microsystems

11-11:25am

THAM1 – MANUFACTURING / PROCESS OPTIMIZATION

Bridging the Interconnect Gap for High Performance Computing using an M-Series Embedded Cache Interposer
Benedict San Jose, Deca Technologies, Inc (Robin Davis; Tim Olson)

Poster Session 11 :30am-12:30pm

SESSION CHAIRS:
Erica Folk, Northrop Grumman; Jon Aday, Amkor Technology

Open-Cavity Plastic Packages: A Robust Solution for High-Reliability Applications
Sam Sadri, QP Technologies (Tom Tammen)

New Packaging Technology for 2-dimensional VCSEL Arrays and Their Electro-Optical Performance and Applications
Rainer Dohle, Micro Systems Technologies (Maximilian Wallrodt; Gerold Henning; Cristoph Greus; Christian Neumeyr; Juergen Rosskopf; Robert Hohenleitner)

Novel Micro-Textured Film Offers Promise in Universal Handling of 3D Devices
Raj Varma, Delphon

The Effects of Voids on Solder Joint Reliability in First Level Interconnect
Sze Pei Lim, Indium Corp.

Thermal Performance of Liquid Metal Paste Containing low Content of Metal Particles for Thermal Interface Materials
Guangyu Fan, Indium Corp.

Member Booth Information: