SPTS invites you to join us for the third and final part of our free online webinar series on Advanced Packaging, titled, “PVD Processes for UBM/RDL“. This 35-40 min presentation will describe recent developments in this market and focus on the challenges and solutions for metal deposition using physical vapor deposition (PVD) in specific applications.
With the adoption of organic materials for passivation and substrate materials (e.g. epoxy mold in FO-WLP) the technical challenges for under-bump metal (UBM) and redistribution layer (RDL) deposition are predominantly in the areas of pre-treatment, becoming even more challenging as line/space dimensions reduce to increase I/O density, improve device performance, and reduce form factor.
This webinar will explain some unique features of SPTS’s Sigma® fxP that offers low and stable contact resistance (Rc), whilst delivering CoO advantages over other PVD systems, with hardware options tailored specifically for BEOL users, where CoO, throughput and yield are critical.
This online event requires registration
Date: Wed 10th Nov 2021
Session 1: 08:00 UK / 09:00 EU / 16:00 China and Taiwan / 17:00 Korea
Repeat Session: 09:00 PST (USA) / 12:00 EST (USA) / 17:00 UK / 18:00 EU
Please note that BOTH sessions will be live events, and the same slides will be presented in each session
Presenter: Chris Jones, Senior Director, PVD Product Management
Chris Jones is Senior Director for PVD Product Management. He is responsible for the SPTS PVD product line covering all aspects of marketing including product positioning and the provision of support to the worldwide sales team.
After completing his BEng in Mechanical Engineering in 1995 at the University of Bristol, UK, he joined SPTS working in Field Service and then Process Engineering before moving into Product Management in 2004. Chris has presented widely on SPTS products and is an author of several technical articles.
