ECTC 2021 Features the Hottest Topics and Trends in Microelectronics

For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1, 2021, and close on Sunday, July 4, 2021. Keynotes, plenary sessions, and the special panel focus on the year’s most talked-about trends including:

The impact of COVID 19 on the microelectronics industry
A chiplet-based future and what it means
Market trends and the geo-political outlook
The Heterogeneous Integration Roadmap
Transitioning to renewable energy
ECTC Diversity Panel
Virtual Women’s Lunch Panel
And more…

ECTC 2021 Technical Program

The ECTC 2021 conference agenda includes over 350 technical papers organized into 46 topical sessions, where each session will be available as an on-demand webcast for the duration of the conference.

The technical program contains papers covering leading-edge developments and technical innovations across the packaging spectrum. Topics include wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, interconnections, packaging for high speed and high bandwidth, photonics, flexible and printed electronics. Special sessions and panels will be available both live and on-demand.

Many of our 3D InCites Community and Advisory Board Members are participating via virtual exhibits or chairing and/or presenting on panels and special sessions. Here is the shortlist:

ECTC 2021 Plenary Session

Transformation of the Electronics Industry in a Post-Covid World
Session Chairs:
E. Jan Vardaman (TechSearch International, Inc.), Mark D. Poliks (Binghamton University) and Kimberly Yess (Brewer Science, Inc.)

Date: June 3, 2021
Time: 11:00 AM EDT
Session sponsored by: Brewer Science

ECTC 2021 Special Panel

Market Trends and the Geopolitica Outlook
Chaired by Rozalia Beica and Ed Sperling

Date: June 2, 2o21
Time: 8:00 pm EDT

ECTC Special Session

Heterogeneous Integration Roadmap
Session Chairs: Bill Chen – ASE and Bill Bottoms – 3MTS
On-demand/Live Q/A

Heterogeneous Integration uses packaging technology to integrate dissimilar chips, devices, or components with different materials and functions, and from different fabless design houses, foundries, wafer materials, feature sizes, and companies into a system or subsystem. Twenty-three technical working groups will present their areas of expertise. This workshop is a half-day pre-recorded event with a planned follow-up live Q/A session.

Representatives from ASE will also be participating in Special Sessions:

Heterogeneous Integration Roadmap: Rising to the Chiplet Challenge
Heterogeneous Integration Roadmap: Test in Heterogeneous Integration

Community Member Achievements

Congratulations to:

LPKF for its Outstanding Interactive Presentation Paper on “Processing Glass Substrate for Advanced Packaging Using Laser-Induced Deep Etching” By Rafael Santos, Jean-Pol Delrue, Norbert Ambrosius, Roman Ostholt, Stephan Schmidt – LPKF Laser & Electronics AG
25 Years ECTC Volunteer Award:
J Rao Bonda – Amkor Technology
Jan Vardaman – TechSearch International
10 Years ECTC Volunteer Award:
Vikas Gupta – ASE US, Inc.

2021 Virtual Technology Corner Exhibits

ECTC’s Technology Corner will be all virtual and accessible to all conference registrants. This year’s virtual format still provides opportunities for exhibitors and attendees to interact with one another and learn about new technology solutions, applications, and products for the packaging and interconnect industry. Of the 50 plus companies participating, 15 are Community Members. Be sure to drop in to chat with: