Semiconductor industry: it is imperative to innovate. Advanced packaging is the path forward…
Leading players must act fast and play on their strengths to innovate and compete. And advanced packaging could most certainly be a pivotal approach.
Advanced packaging has become essential for semiconductor innovation. Advanced packaging platforms allow this industry to explore new eras and innovate. And today, advanced packaging technologies are the key to bridge the gap between die and PCB.
In this dynamic context and encouraged by 7 consecutive years of successful symposiums that have attracted more than 200 participants on average, Yole and its partner NCAP (National Center for Advanced Packaging) are proud to announce this year again, the Symposium by Yole Développement and NCAP on Advanced Packaging Semiconductors – SYNAPS.
May 18-20, 2021 | Online
As a digital event, SYNAPS offers a unique place in the world where leading companies can share their vision of the advanced packaging industry, evaluate the emerging platforms, and identify business opportunities.
SYNAPS, an unprecedented program.
SYNAPS’s aim is to deliver a comprehensive understanding of the status of the advanced packaging industry and help companies to be part of the ‘tomorrow’ industry.
SYNAPS is unique. Don’t miss it!
More information is available here.
