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Featuring guest speakers from local fabs, the Rudolph Yield Forum China provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges.
Register here!
General Session
- The New Age of Semiconductors—Our Industry Growth Drivers
- MEOL—BEOL Supply Chain Perspective on the 2.5D Packaging Landscape: A Survey of Advancements in Kiru (切る), Kezuru (削る), Migaku (磨く) Processing Technologies for TSV-Enabled Device Fabrication, DISCO guest speaker
- Emergence of the Middle-End: Convergence of Front-End and Back-end
Wafer Processing (Front-end) Session
- TSV Middle Inspection and Metrology
- Intro to SEM ADC
- Advanced Macro Inspection for Single Wafer Yield Loss and Bubble Detection on BSI CMOS Image Sensors, XMC guest speaker
- Metrology Challenges and Techniques for Gate Oxide Control at 1 and 2x Nodes
- Supply Chain Value
- Bare Wafer Inspection
- Fleet Management: Optimizing your Rudolph Inspection Systems
- Server-centric Productivity Solutions for Metrology
- MEOL Lithography
Final Manufacturing (Back-end) Session
- Trends in Cu Pillar Bump Metrology and Yield Improvement Strategies
- Fault Detection and Classification in Advanced Packaging
- Lithography for Bumping, RDL, Fan-Out & Interposers
- 3D Measurement for TSV, MEOL, RST and Temporary Bonding
- Fleet Management: Optimizing your Rudolph Inspection Systems
- Metrology Techniques for Advanced Packaging Processes
- Closed Loop Total Solution for Advanced Packaging Lithography
- Monitoring Process Tool Particles & Edge Trip Defects using Darkfield Laser Scattering Technology
- A Comprehensive Solution for Post-saw Delamination including Reduced Review
**Topics subject to change
For More Information:
Contact:Wendy Wang, Rudolph China
Email: wendy.wang@rudolphtech.com
Tel: +86-21-60930600
