Opportunities abound for the semiconductor industry as a new wave of revolutionary applications emerge. However, these opportunities will be met by technical challenges that force the semiconductor industry to tackle manufacturing, packaging and design with novel solutions. This event will examine the use of nanoscale engineering, heterogeneous integration and 2.5D technology, three emerging technologies that are poised to drive increased chip performance and shape the industry’s innovation landscape in years to come.
Holding great promise for enabling heterogeneous integration and reducing design complexity, this year’s GSA Silicon Summit session on the 2.5D and 3D Ecosystem will provide an overview on where the industry stands in terms of developing and commercializing 2.5D/3D technology and what remains to be done including a panel on utilizing 2.5D/3D technology and the business needs within the supply chain to ignite 2.5D/3D adoption and market growth.
Moderated by Javier De La Cruz, Senior Director of Engineering for eSilicon Corporation, panelists include:
- Calvin Cheung, Vice President of Engineering, ASE US
- Bob Patti, Chief Technology Officer, Tezzaron
- Arif Rahman, Program Director & Architect, Altera Corporation
- Brandon Wang, Director, 3D-IC Solutions, Silicon Realization Group, Cadence Design Systems, Inc.
