Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply chain becomes more important than ever. So, when the 3D InCites Member Advisory Board reviewed this year’s finalists for the 2025 3D InCites Technology Enablement...
Empowering the Future: New York’s Semiconductor Industry Surge
In 2024, New York’s semiconductor industry experienced substantial growth, driven by increased funding from both the U.S. government and the expansion of IBM along with other key industry suppliers. As a result of these recent public and private initiatives, the NY CREATES’ Albany NanoTech Complex—the largest non-profit semiconductor R&D facility...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging, process control, and inspection solutions, while various acquisitions strengthened the U.S. semiconductor supply chain. There were various new hiring opportunities across the industry, upcoming conferences, and notable achievements. Innovation and...
Navigating the Shortage of Semiconductor Engineers: Tips from the Experts
You may have heard that for the semiconductor industry to reach $1 trillion, it needs around one million new workers globally. This includes entry level talent, technicians, supporting roles like accounting and human resources, and of course, semiconductor engineers. As it stands, no single industry has ever reached $1 trillion...
IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3
Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards: Optical Interface Forum (OIF) – The XSR and USR physical layer specifications optimized for die-to-die connectivity Chips Alliance – The AIB specification which was originally introduced by Intel Open Compute...
Asia May Still Be the Hottest Spot for Advanced Packaging
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...
Sustainability 101: 2025 and Progress Toward Sustainability Goals
Happy New Year 2025. How are those 2030 sustainability goals coming along? If you committed to 2025 goals, are you on target to reach them this year? If you feel behind, you have plenty of company. Speed and Scale by John Doerr, published in 2021, laid out a plan for...
SEMI ISS 2025: Ready, Set, Ramp!
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has...
How Arizona is Growing its Advanced Packaging Capabilities
An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub for advanced packaging innovation. The year 2022 was monumental for the semiconductor industry. That year, the Biden-Harris administration committed to making the U.S. a world leader in semiconductor manufacturing by...
2024: A Year of Growth and Innovation
2024 was another year of significant growth for Trymax Semiconductor Equipment B.V. This year was marked by several pivotal developments, including the successful ramp-up of our new manufacturing facility, the establishment of a dedicated Quality Department, the expansion of our team with additional Field Service Engineers, and the growing momentum...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked dynamic random access memories (DRAMs) for high bandwidth memory (HBM) components. According to reports, the company is now considering entering the OSAT market by way of a strategic partnership with...
3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off and on for 30ish years. If you are in the semiconductor process side of the world, this is one of the better conferences to attend to get up to speed...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the World! In 2008, we tempered that declaration to Advanced Packaging Drives the Industry! By 2009,...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The new platform relies on TSMC’s CoWoS and other advanced packaging technologies. It will allow designers to build system-in-packages (SiPs) of 3D-stacked logic,...
December Member News: Celebrating Progress and Achievements
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated many achievements in December. From groundbreaking technological advancements and well-deserved industry awards to strategic collaborations and significant company developments, our members are continuing to lead the way in their fields....
IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027
TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will achieve certification by 2027, introducing a version with 9x reticle size. This will allow twelve HBM4 memory stacks, providing unprecedented performance enhancements for artificial intelligence (AI) and high-performance computing (HPC)...
Unpacking AI’s Power-Hungry Demands
With artificial intelligence (AI) spearheading many of the innovations in the microelectronics industry, Mike Ranjram, assistant professor at Arizona State University, shared his insights on data center power delivery for the evolving AI ecosystem. Speaking to a room of advanced packaging professionals at IMAPS’s last 2024 chapter event at Saras...
The 3D InCites Podcast Backtrack – 2024 in Review
Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes. So we thought we’d share it with you, our listeners and sponsors, to give you...
It’s Time to Put AI’s Growth Into Perspective
These days, it seems like artificial intelligence (AI) is taking over the world. In the last two years alone, we’ve seen the rise of ChatGPT, autonomous vehicles, Google Gemini, deep fakes, and my least favorite – soulless AI art. With so many new applications coming into focus, it can feel...
IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take a look. With Intel struggling to make its foundry business profitable, Digitimes questions whether Intel should consider abandoning its IDM model and separate its product design and manufacturing divisions. The...
