The 10th Annual Device Packaging Conference (DPC 2014), held in Fountain Hills, Arizona, on March 10-13, 2014, provides a forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
The 2014 Technical Program will feature Topical Workshop Tracks on: Advanced 3D Packaging; Flip Chip and Wafer Level Packaging; and Packaging Innovations & System Challenges for: MEMS, Microsystems & Devices; and Photonics Packaging. Device Packaging 2014 will offer 15 technical sessions over 2.5 days, more than 80 presentations from speakers from around the industry and globe, and 6 keynote presentations from: Steve Bezuk, Qualcomm; Brandon Prior, Prismark; Bryan Black, AMD; John Peddie, JPR; Glenn Daves, Freescale; and Yole.
