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Rudolph’s Yield Forum Japan 2013 is a technology and applications forum focused on inspection, metrology, lithography and process control solutions for 2.5D and 3DIC device manufacturers, Rudolph’s Yield Forum shares technical data and experience in deploying solutions for emerging advanced packaging processes. This Forum will be of interest to fab managers, yield managers, applications specialists and tool owners.
Location: Makuhari MESSE, International Conference Hall 1F
Agenda Highlights
- Bringing Front-end Requirements into the Back-end
- Fleet Management: Optimizing your Inspection Systems
- 450mm Inspection, Metrology and Advanced Packaging Lithography
- High Speed Inspection and Metrology for Advanced Packaging
- Fault Detection and Control (FDC) for Advanced Packaging
- Trends in Cu Pillar Bump Metrology and Yield Improvement Strategies
- Metrology Techniques for Advanced Packaging Processes
- Etch Chamber Clean and Blank Carrier Wafer Inspection
- Lithography Solutions for Fan-out Packaging & High Density Interposer
For more information or to register:
Contact: Rudolph Technologies, Japan
email: yieldforum@rudolphtech.co.jp
Tel: 044-829-6513
