Semicon Taiwan is coming up again, this year boasting 110 or more speakers, and 50 hours of technical and business forums. These include presentations from global and regional industry leaders ASE, GLOBALFOUNDRIES, IBM, Micron, STMicroelectronics, TSMC, and Qualcomm among others. Scheduled sessions include the SEMICON Taiwan Executive Summit, the IC Design Summit, Market Trends, Memory Executive Summit, CMP Forum, Lithography/Mask Symposium, Advanced Packaging Symposium, Green Manufacturing, and sessions on MEMS and LED manufacturing.
This year the the conference introduces specialized exhibit theme pavilions, with a whole pavilion devoted to showcasing to 3D IC developments. Additionally, the SiP Global Summit, which runs during SEMICON Taiwan, will feature a one day forum devoted to 3D IC topics. Organized by Semi, registration for the event is currently open. To register, visit SEMICON Taiwan’s website.
