Abstracts are now being accepted for the NCCAVS Joint User Group Meeting on 3D Packaging June 11, 2013.
After more than a decade the industry continues to recognize the power of the third dimension in package and sub-system assembly for the implementation of highly integrated electronic products. 3D assembly and packaging of both active and passive devices opens a new world of performance and integration to system designers. Numerous approaches reported and demonstrated include those based on package stacking (package-on-package, origami, and edge stacked modules) and those based on die stacking (wire bond, mixed technology, edge redistribution, and through-silicon-via or TSV).
Meeting attendees represent a broad audience of managers, engineers, technicians, professors, students, and others involved thin film, CMP, and plasma applications.
Hosted By:
- Chemical Mechanical Planarization User Group
- Plasma Applications Group
- Thin Film Users Group
Co-chairs:
- Hok-Kin Choi, hokkin.choi@intel.com
- Lucia Feng, lmfeng@earthlink.net
- Kapila Wijekoon, Kapila_Wijekoon@amat.com
Abstract/Presentation Submissions
Please submit an abstract (less than 200 words) of your presentation byApril 30, 2013 to the Co-Chairs listed above. Authors will be notified of acceptance to the conference by return e-mail.
