SEMICON West is the flagship annual event for the global microelectronics industry. More than semiconductors, SEMICON West is also showcase for emerging markets and technologies born from the microelectronics industry. This year, 3DIC discussions are incorporated into Keynotes and Executive Panels such as the SEMICON West 2013 R&D Panel – “A Conversation on the Future of Semiconductor Technology” and SEMICON West 2013 Executive Panel – “A Promising but Challenging Future”, where supply chain and business implications will be addressed alongside 3D transistors (finFETS), the transition to 450mm and EUV.
One TechXpot session titled Advancing 2.5D and 3D Packaging through Value Engineering will take a critical look at supply chain ecosystem participants who are pioneering tools and materials, exclusively geared towards high volume implementation of 2.5D and 3D packaging.
Visit the SEMICON West 2013 website for the full scope of this year’s program.
