Yole Développement & NCAP have decided to continue and strengthen the collaboration to organize the Advanced Packaging & System Integration Technology Symposium for the 4th time.
The advanced packaging is on the move. Emerging application is bringing new challenges, and packaging experts from all over the world will come to exchange for their vision and future perspectives. Don’t miss it!
The unique single-meeting event will take place in one of the most dynamic places in the semiconductor: Wuxi, China, from June 20 to 21, 2018.
During 2 days, all packaging aspects including Panel Level, Fan Out, System in Package, Advanced Substrates, 3D Technology will be discussed. Focus on key applications such as 5G, Automotive, Artificial Intelligence and Memory will be at the heart of the conference.
Yole Développement and NCAP previously announced the agenda for the 2018 edition: just click here.
Symposium highlights:
- More than 20 impressive talks divided into six sessions (Advanced Power Packaging, Panel Level Packaging, Fan-Out Wafer Level Packaging, High End, Equipment for WLP and Advanced Packaging Materials)
- Short Courses with ASE Global, University of Science & Technology of China and Georgia Institute of Technology
- Discuss with your peers during more than 5 hours of networking times
- Debate during the panel session
Experts from the advanced packaging area are preparing for a symposium that has yet to find its equal, as this is the place to exchange experiences and ideas that might shape the industry’s future and meet Chinese companies. Find more information on the event webpage.
Can’t wait to experience this top-quality event live? Register now
