Dr. Phil Garrou, Microelectronic Consultants of NC, USA
Dr. Phil Garrou is a subject matter expert for DARPA and runs his consulting company Microelectronic Consultants of NC in the RTP NC area. He retired from Dow Chemical in 2004 as Global Director of Technology for their Advanced Electronic Materials business unit. Phil has served as Technical VP and President of both IEEE EPS and IMAPS and is a Fellow of both organizations. He has edited several microelectronic texts including McGraw Hill’s “Multichip Module Handbook” and Wiley VCH’s “Handbook of 3D Integration”. He has won the Milton Kiver Award for Excellence in Electronic Packaging (1994); and the Fraunhofer International Adv. Packaging Award (2002); the IEEE CPMT Sustained Technical Achievement Award (2007), the IMAPS Ashman Award (2000) and most recently the American Chemical Society Award for Team Innovation (2017). His weekly publication Insights From the Leading Edge (IFTLE) has been a weekly advanced packaging blog since 2010.
Dean Freeman, Chief Analyst at FTMA
Dean Freeman is a technology advisor and a twice-monthly contributor to 3D InCites. He covers heterogeneous integration and sustainability topics as they pertain to the greater semiconductor industry. Dean has over 40 years of life experience in the semiconductor manufacturing and materials space, where he has had experience in nearly every sector of the semiconductor manufacturing process. He has worked both in the fab and for semiconductor equipment manufacturing companies. Dean is also an industry analyst at Kiterocket Insights. Prior to joining 3D InCites, Dean was a research VP for Gartner tracking semiconductor manufacturing, process technology, and multiple aspects of the internet of things. He has also worked at FSI, Watkins Johnson, Lam Research, and Texas Instruments. Dean has 9 process and equipment patents and has written multiple articles in various trade and technical journals. He holds a BS in Chemistry and Earth Science and an MS in Physical Chemistry. He is also a certified Ski Instructor.
Julia Goldstein, Principal, JLFG Communications
Julia Goldstein is an author and business owner on a mission to make manufacturing more environmentally responsible. She has a background in engineering, journalism, content writing, and teaching and holds a Ph.D. in materials science. Julia’s company, JLFG Communications, works with manufacturers to help them connect business goals, environmental action, and effective communication strategies.
Julia’s first book, Material Value, is a B.R.A.G Medallion Honoree, Finalist in the 2019 San Francisco Writers Contest, and Semifinalist for the 2020 Nonfiction BookLife Prize. She is also the author of Rethink the Bins, which received a Gold award from the Nonfiction Authors Association. Her latest book, Beyond the Green Team, was published in 2022.
Steffen Kröhnert, Founder and President, ESPAT-Consulting
Steffen Kroehnert is President & Founder of ESPAT-Consulting based in Dresden, Germany. He provides a wide range of consulting services around Semiconductor Packaging, Assembly, and Test, mainly for customers in Europe. He spent more than 20 years in different R&D, engineering, and management positions at large IDMs and OSATs in Germany and Portugal, namely Siemens Semiconductors, Infineon Technologies, Qimonda, NANIUM, and Amkor Technology, where he most recently served as Senior Director Technology Development.
Since 2016 Steffen has chaired the European SEMI integrated Packaging, Assembly and Test – Technology Community (ESiPAT-TC). Steffen has authored or co-authored 23 patent filings and many technical papers in the field of Packaging Technology. He also co-edited the book “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies”. He is an active member of several technical and conference committees of IEEE EPS, IMAPS and SEMI Europe. Steffen holds an M.S. in Electrical Engineering and Microsystems Technologies from the Technical University of Chemnitz, Germany.
Community Member Representatives – Two-Year Terms
E. Jan Vardaman, President and fFounder of TechSearch International, Inc., USA
E. Jan Vardaman founded TechSearch International Inc. in 1987, and since then has provided licensing and consulting services in semiconductor packaging. She is the co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly/Printed Circuit Board Fabrication, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. Jan is a member of IEEE CPMT, SMTA, MEPTEC, IPC, IMAPS, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. Before founding TechSearch International, Jan served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. She has made numerous presentations on developments in advanced packaging.
Beth Keser, President, International Microelectronics and Packaging Society
BETH KESER, Ph.D. is a recognized global leader in the semiconductor packaging industry with over 25 years of experience. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 41 US patents and patents pending and over 50 publications in the semiconductor industry.
For more than 7 years, Beth led the Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group at Qualcomm where she and her team qualified over 50 products resulting in over 10 billion units shipped–technology consumers around the world enjoy in mobile phones. Following that, Beth led Intel’s worldwide Packaging & Systems Technology department for 7 years. Beth is currently VP of Manufacturing Technology at Zero ASIC.
Clemens Schütte, Director of Marketing Communications, EV Group
Clemens Schütte is the Director of Marketing and Communications at EV Group (EVG). In his role, he is responsible for corporate communications, public relations, exhibitions and events, advertising and promotion, and internal communications. Clemens leads the central marketing team at EVG’s headquarters, working closely with dedicated marketing contacts in the company’s worldwide subsidiaries to ensure end-to-end, consistent global coordination and implementation of all communications programs.
Prior to EVG, Clemens held several marketing and communications positions at Sony Europe, most recently as senior communications manager, and at NEC Europe. He holds a degree in business administration, with a focus on marketing, international management, and industrial management/production engineering, from the Friedrich-Alexander University Erlangen/Nuremberg, Germany.
Manuela Junghähnel, Fraunhofer IZM-ASSID
Manuela Junghähnel is the head of the Center All Silicon System Integration Dresden – ASSID of Fraunhofer Institute for Reliability and Microintegration IZM. Her working field is focused on leading-edge advanced packaging and 3D heterogeneous wafer-level system integration. Fraunhofer IZM-ASSID operates a state-of-the-art 300 mm process line for 3D wafer-level system integration. Besides the activities at IZM-ASSID, Manuela leads the Center for Advanced CMOS & Heterointegration Saxony, together with Dr. Wenke Weinreich from IPMS-CNT.
Manuela has more than 20 years of experience in the development of PVD processes, thin-film technology, and new functional materials for large-area and electronic applications at Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP, at last as Manager of the department S2S Technologies & Precision Coating. She received 2011 her Doctor of Engineering in the Dept. of Mechanical Engineering in the research field of niobium doped titania as transparent conductive material from the Technical University of Ilmenau, Germany.
