As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolphin Resort in Florida. The lineup represents all aspects of 3D and through-silicon via (TSV) technologies, wafer level packaging (WLP), flip chip, electrical and mechanical modeling, RF packaging, system design, materials, and optical interconnects. All sessions will be filled with the kind of riveting information that can only be found at Walt Disney World.
The first session I look forward to attending is the “Panel Fan-Out Manufacturing: Why, When, and How?” chaired by Jean Trewhella and Young Gon Kim. A panel of experts including Douglas Yu, TSMC; Tim Olson, DECA; Steffen Kroehnert, NANIUM; Rolf Aschenbrenner, IZM Fraunhofer and Steve Bezuk, Qualcomm Technologies, Inc. will discuss the development of fan-out packaging, technology roadmaps, and cost-effective solutions for product applications.
If you want to get the latest information on advanced multi-chip packaging, then Wednesday’s luncheon is the event you don’t want to miss. Babak Sabi from Intel Corporation will be the keynote speaker discussing the technology giant’s perspective on advanced packaging opportunities and challenges.
This year at ECTC, the CPMT Woman’s Panel and Reception will focus on Emotional Intelligence (EI) and Link to Successful Leadership. Mark your calendars for Wednesday, May 31, 2017, 6:30 p.m. to 7:30 p.m. to hear Kitty Pearsall, Boss Precision, Inc., and other panelists share about their experience and accomplishments as leaders in the microelectronics industry.
Tomorrowland isn’t the only place you’ll get a peek inside the cars of the future. On Wednesday, May 31, 2017, at 7:30pm-9pm Luke England from GlobalFoundries will be speaking about industry roadmaps and visions for autonomous vehicles. The panel of experts includes Venky Sundaram, Georgia Institute of Technology; Brent Richardson, Texas Instruments; Frank Bertini, Velodyne; Dongji Xie, Nvidia and Raj Pendse, Qualcomm Technologies, Inc. The discussion will include requirements for packaging and reliable challenges to support widespread implementation of autonomous vehicles on the road.
ECTC offers enough variety of sessions focuses on microelectronics packaging and components technologies to satisfy any engineer, manager, student, or executive. A list of all the sessions can be found directly in the downloadable program. Make a plan to join your colleagues at the happiest place on earth this May.
Please come by and say hello at our 3D InCites table. We would love to hear about your progress with 3D and heterogeneous integration technologies. Be sure to submit a nomination for the 2017 3D InCites Awards.
