The European 3D Summit will take place on January 23-25, 2017 at Minatec in Grenoble, France, with the theme “European 3D Summit 2017 – Creating High-Density Systems.” It is the place to see leading companies, technologies, and people driving the future of 3D Integration design and manufacturing. 3D Summit exhibitors are the suppliers to and the partners of leading microelectronics companies. Sold-out for three years straight, the exhibition showcases the most prominent names in 3D Integration microelectronics manufacturing.
The 2017 SEMI European 3D Summit will continue to explore a wider scope of 3D topics that include 3DIC Through-Silicon-Via (TSV) technology and associated challenges. In addition, the Summit will include discussions on 2.5D, 3D FO-WLP/ e-WLB, glass interposers, and 3D alternative technologies for Heterogeneous Integration and High-Density Systems. Leading thought leader keynote and technical speakers will present their approaches and strategies for 3D Integration technologies, with particular attention on current adoption for applications such as high-end memories, performance applications, mobile, imaging, and automotive.
In the past few years, the increasing use of 3D technology in microelectronics devices has reshaped the electronics market. As in previous SEMI European 3D Summits, SEMI will highlight the latest business challenges and opportunities in the 3D sector with a market briefing, where attendees will hear from 3D and packaging industry experts discuss business and market insights and reverse engineering analysis.
Up to 30 companies working on 3DIC and advanced packaging will have the opportunity to exhibit their technologies and solutions at SEMI European 3D Summit exhibition. Located adjacent to the conference auditorium, the exhibition will be a high-traffic hall giving exhibitors many opportunities to interact with potential customers and manufacturers. In addition to high-caliber speakers and exhibitors, The SEMI European 3D Summit will provide attendees with numerous networking opportunities throughout the event, including networking lunches, coffee breaks, a gala dinner, and a complimentary one-on-one business meeting service.
SEMI will also arrange for attendees a chance to visit the Minatec Showroom, near the conference amphitheater, for a taste of the latest innovations currently in development within the Grenoble tech hub.
The European 3D Summit steering committee includes executives from ams AG, BESI, CEA-Leti, Evatech, EV Group, Fraunhofer-IZM, Globalfoundries, imec, Scint-X, SPTS, STMicroelectronics and SUSS Microtec.
The SEMI European 3D Summit consistently has a high industry turn-out with stellar satisfaction rates (96% overall satisfaction rate, 2012-2016).
Please visit www.semi.org/European3DSummit to find out how to register as an attendee or how to book a booth as an exhibitor. Sponsorship packages are also available. Early-bird pricing will be available until 31 October. For additional information please contact Anne-Marie Dutron at the SEMI Europe Grenoble Office via email at adutron@semi.org.
