The Electronic Components and Technology Conference (ECTC 2025) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
ECTC 2025 will be held at the Gaylord Texan Resort & Convention Center in Dallas, TX from May 27-30.
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
Program details are yet to be announced. Register here.
