Announcing the Winners of the 2025 3D InCites Awards

Siemens Digital Industries Software – Innovator3D IC platform

Siemens’ Innovator3D IC platform, introduced in September 2024, is an AI-enhanced co-design tool that ensures digital continuity using system-centric planning for die, interposer, package, and PCB design. Innovator3D IC leverages predictive modeling for power, performance, area, cost, and reliability optimization, supporting standard interfaces like the Universal Chiplet Internconnect Express (UCIe), high bandwidth memory (HBM), and Bunch of Wires (BoW). By providing early insights into thermal, mechanical, and electrical performance, it reduces design iterations and accelerates development. This comprehensive solution empowers engineers to create optimized, production-ready designs, transforming semiconductor design workflows.

Saras Microdevices – STILE™

Saras Micro Devices is redefining power delivery for high-performance computing (HPC) and AI applications with its innovative STILE™ embedded capacitor and voltage regulator solutions. These products enable embedded vertical power delivery (eVPD), reducing power delivery losses and improving efficiency by shortening the power pathway and minimizing the need for surface-mount components. This approach supports higher power densities in compact designs, unlocking the full potential of chiplet-based, multi-device architectures. Manufactured in Chandler, AZ, Saras collaborates with leading semiconductor suppliers to tailor STile solutions, accelerating design cycles and advancing integration for next-generation processors.

ACM Research – Ultra ECP ap

With the growing demand for AI applications requiring large chiplet GPUs and high-density HBM, the industry is shifting from traditional 300mm wafer packaging to larger substrates like 510x515mm or 600x600mm to reduce costs and improve efficiency. ACM Research’s Ultra ECP ap system is the first commercial high-volume copper deposition tool designed for panel-level packaging, offering advanced solutions for processes like pillar, bump, and RDL plating. Its horizontal chamber configuration is designed to ensure excellent uniformity, minimizes contamination, and supports up to 16 plating chambers. The system is operational in cleanrooms, with additional units set for deployment to customers.

MacDermid Alpha – NOVAFAB Fine Grain Copper

MacDermid Alpha Electronics Solutions addresses key challenges in heterogeneous integration (HI) and hybrid bonding with its NOVAFAB Fine Grain Copper electroplating process. Designed for high-density interconnects, this ultra-pure copper film ensures controlled grain growth during annealing, enabling defect-free bonds and enhanced device reliability. With a sub-2μm grain size, it minimizes signal degradation and meets the mechanical and electrical demands of advanced applications. Seamlessly integrating into high-volume manufacturing, NOVAFAB supports the performance and yield requirements of 3D stacking and chiplet integration, making it a reliable and scalable solution for next-gen electronics.

Nhanced Semiconductor – 3D Hybrid Integration

NHanced Semiconductor Inc. is revolutionizing heterogeneous 3D hybrid integration (3DHI) by overcoming challenges associated with integrating diverse materials like GaN, SiC, and LiNbO3. Using techniques such as incremental annealing and material thinning, NHanced achieves high-density interconnects with hybrid copper and covalent oxide bonding. These innovations enable the production of advanced 3DHI devices with unprecedented performance and power efficiency. By facilitating the integration of exotic materials, NHanced unlocks new possibilities, including intelligent AI-enabled IR sensors, advancing applications previously unattainable with traditional approaches.

Special Consortium Award – Resonac

There were two technology enablement applications representing industry consortiums, which are expected to play critical roles in solving today’s complex challenges. As such the board decided a special Consortium Award was in order. While both groups are doing great work, the board selected Resonac as the winner.

To address challenges in heterogeneous integration and chiplet packaging, Resonac developed the JOINT2 Consortium, which focused on fine pitch bonding, underfill materials, and advanced processes like semi-additive plating and polymer damascene. Achievements include successful 10μm pitch bonding with flux-less technology and demonstrated 1/1μm line/space capabilities.

Building on this success, Resonac is leading the US-JOINT consortium in Silicon Valley, partnering with 10 global manufacturers and institutions like the Texas Institute for Electronics to accelerate R&D in advanced packaging. This initiative fosters collaboration across materials, equipment, and design to fast-track commercialization and innovation.

Engineer of the Year – Rex Anderson, Micross

After narrowing the field down to two worthy finalists, the Advisore Board awarded Engineer of the Year to the individual who they felt went above and beyond to engage with his peers through participation in industry organizations, whether it’s teaching professional development courses or mentoring young engineers.

With over 25 years of semiconductor expertise and a PhD in Nuclear Engineering from the University of Michigan, Rex Anderson has a track record of innovation at Applied Materials, Amkor, and RTI Microsystem Integration. He leads the Secure Center for Advanced Packaging of Excellence (SCAPEx), the company’s largest project under the DoD RESHAPE program, The goal is to establish a secure 300mm wafer bumping and finishing facility. Through meticulous planning and collaboration, Rex has kept the project on schedule and within budget, with the 300mm line set to launch by late 2025, solidifying Micross as a leader in advanced wafer processing.

Rex is a true believer and proponent of industry collaboration to achieve technology innovation. “Anyone who has been in advanced packaging for any significant amount of time knows that the key ingredients for innovation in advanced packaging is humility mixed with open collaboration” he said.  When asked what his greatest contribution to the engineering profession is, Rex responded: “My greatest contribution to the engineering profession is not necessarily what I accomplished in my career, but the time I contributed to encourage students to pursue engineering and science. From an early age, I valued and appreciated the time others gave to me when teaching me how to fix something around the house or when they encouraged me in my studies at school. Therefore, I gauge the weight of my own contribution to engineering in the amount of time I give back to others.”

Best Place to Work –  Saras Micro Devices

For the second year, we opened up the decision for Best Place to Work Award to YOU – our audience. Each person had one chance to vote. Since the finalists represented companies large and small, we leveled the playing field by tallying the votes as a percentage of the company’s total employee base. While all of the finalists have shown themselves to be exemplary places to work, this year’s winner had more votes than employees.

Saras Micro Devices is known for its inclusive, dynamic, and thriving environment that fosters continuous learning, professional development, and employee well-being. Innovation through collaboration is central to the company’s culture, where cross-functional teams work together, and diverse perspectives drive progress. Saras celebrates diversity, equity, inclusion and belonging through team-building activities and community outreach initiatives. The company supports work-life integration with flexible hours and generous paid time off while offering competitive salaries, benefits, and performance bonuses. Saras values its employees through peer recognition and rewarding milestones with unique experiences, making it a place where careers flourish and employees feel truly valued.