Through the next generation of its CA20 X-ray inspection solution, Comet Yxlon answers the semiconductor industry’s call for fast and efficient analyzing of advanced packaging ICs. By combining high-resolution 3D X-ray and automated 3D metrology for CoS (chip-on-substrate) solder connections, the new CA20 enables manufacturers to identify and eliminate systematic yield issues faster than ever before.
Its three-dimensional X-ray images with resolutions below 1 µm allow for reliable and automatic detection of critical defects in IC solder connections, such as bump shift, voids, or head-in-pillows, as well as deviations in stand-off height or deformations. With the latest revision of the CA20 system, Comet Yxlon now offers modular solutions for CoS inspections from lab to fab. It features manual, assisted, and fully automated defect recognition, as well as full integration into the production line for continuous process monitoring.
In the “more than Moore” era, packages with multiple dies become a core determinant of system performance. The zero-defect production of new, high-performance components is vital in today’s fast-moving market. As an innovative and non-destructive inspection solution, the CA20 supports IC production by accelerating both time-to-market and time-to-volume, in addition to providing real-time process feedback to increase yield.
To address costly structural yield issues before they settle into the production process, the new CA20 supplies manufacturers with automatic 3D metrology powered by a modern, AI-based analysis software. The new EFEM loader is an additional feature that speeds up automated operation in the fab under cleanroom conditions.
Software packages such as Dose Manager, Batch Manager, and Chip-on-Substrate Insights for automated 3D metrology ensure accuracy, reliability, and efficiency for all inspection tasks. All functions are easily accessed via the proven Geminy user interface.
