Presented by Dr. Dongkai Shangguan: IEEE Fellow, Strategic Advisor to Indium Corporation, and President of Thermal Engineering Associates, Inc.
As electronic products become more pervasive in applications, interconnect reliability must be considered holistically with regard to environmental conditions, from thermomechanical to electrical and electrochemical. Thermal dissipation is another great concern as the power density increases. Understanding the failure mechanisms for different interconnect materials at various levels (wafer, chip, package, and system) of the semiconductor package is of great importance to interconnect reliability and device performance.
At the same time, as newer forms of interconnects emerge in advanced packaging to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects in the same package, with complex reliability failure modes and mechanisms.
In this presentation, the technology trends for advanced packaging will be outlined, and the growing demand for new materials for high density interconnects will be discussed. Process robustness, reliability and product performance are some of the important considerations for innovative materials solutions for advanced packaging and heterogeneous integration. Thermal management solutions will also be discussed.
Learn more about the IEEE EPS Phoenix Section Seminar : https://events.vtools.ieee.org/m/438269
ASU MacroTechnology Works
- 7700 S. River Parkway, Tempe, AZ 85284
- Room 3654
- Thursday, November 7th from 5:30-7:30 p.m.
