Semiconductors are the micro-sized “brains” that power modern electronics, and the latest advancements in semiconductor packaging materials are transforming key industries from 5G to AI and automotive by making them smarter, better, and more reliable. Discover how these unseen yet powerful material innovations like thermal die attach solutions are solving critical challenges like heat dissipation and reliability, enabling next-gen devices to achieve superior performance and durability.
Electric vehicles, for instance, are now leveraging to silicon carbide (SiC) and gallium nitride (GaN) based wide bandgap metal-oxide-semiconductor field-effect transistors (MOSFETs) for improved power efficiency. However, novel sintering-based die-attach materials are needed to ensure these semiconductors can withstand high temperatures and harsh conditions.
In AI and high-performance computing (HPC), where immense computational power is necessary, innovative underfill solutions protect the delicate solder bumps connecting thousands of I/O points in semiconductor packages. By efficiently dissipating heat and guarding against mechanical stress, underfills help devices operate reliably, even under intense workloads.
In the 5G and Wi-Fi space, base stations and devices rely on high thermal die attach sintering materials to manage the increased power density and heat generated, ensuring stable signal transmission and protecting chips from environmental challenges like temperature fluctuations and humidity.
Download the eBook from Henkel more how semiconductor packaging materials advances are paving the way for the future of technology and how they can help you overcome key challenges in semiconductor design and manufacturing.
