State-of-the-art innovation lab pushes the limits of advanced semiconductor applications
ZEISS has announced it recently opened the ZEISS Microscopy semiconductor applications lab in Dresden, a state-of-the-art facility dedicated to addressing physical analysis challenges and pushing the limits of nanoscale analysis with the ZEISS Crossbeam focused ion beam-scanning electron microscope (FIB-SEM).
The new facility is strategically located in Dresden, the heart of semiconductor innovation within Europe, allowing for close collaboration with semiconductor industry customers and partners on physical failure analysis, materials development and process yield improvement for advanced logic and memory, power semiconductors, MEMS, advanced packaging, and more. ZEISS will address increased automation of microscopy workflows and advanced techniques to help the semiconductor industry accelerate root cause analysis and pathfinding for the most challenging issues in microelectronics.
This laboratory in Dresden is the third major investment of ZEISS into semiconductor microscopy applications and strengthens the company’s global support capabilities. The Dresden team collaborates closely with its counterparts in Taiwan and Korea to share knowledge and best practices to best address customer needs across these three global hotspots of semiconductor excellence. Importantly, the advanced applications developed by these three teams will steer the innovation roadmap of ZEISS to meet the greatest challenges facing lab professionals in the semiconductor industry.
The semiconductor microscopy applications lab is located within the ZEISS Innovation Hub Dresden that opened last May. The site complements ZEISS’ Innovation Center in Hsinchu Science Park, Taiwan, which opened in June 2024 and features a comprehensive portfolio to meet the productivity needs of semiconductor research & development, production and failure analysis. The third Innovation Center is in Dongtan, Korea, where the company develops applications across a complete portfolio of optical and electronic equipment, X-ray microscopy and high-resolution CT, and 3D metrology instruments.
